| Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . VDSS |
60 |
V |
| Drain to Gate Voltage (RGS = 20kΩ) (Note 1) .. . . . . . . . . . . . VDGR |
60 |
V |
| Gate to Source Voltage . . . . . . . . . . . . . . . . . . . VGS |
±16 |
V |
| Drain Current |
|
|
| Continuous (TC = 25℃, VGS = 5V). . . . .. . . . . ID |
75 |
A |
| Continuous (TC = 25℃, VGS = 10V) (Figure 2) . . . . . . . . . . . . ID |
75 |
A |
| Continuous (TC= 100℃, VGS = 5V) . . . . . . . . . . . . . . . ID |
75 |
A |
| Continuous (TC= 100℃, VGS = 4.5V) (Figure 2) . . . . . . . . . . . ID |
75 |
A |
| Pulsed Drain Current . . . . . . . . . . . . . . . . . IDM |
Figure 4 |
|
| Pulsed Avalanche Rating . . . . . . . . . . . . . . . UIS |
Figures 6, 17, 18 |
|
Power Dissipation . . . . . . .. . . . . . PD
|
260 |
W |
| Derate Above . . . . . . . . . . . . .25℃ |
1.75 |
W/℃ |
| Operating and Storage Temperature . . . . . TJ, TSTG |
-55 to 175 |
℃ |
| Maximum Temperature for Soldering |
|
|
| Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . TL |
300 |
℃ |
| Package Body for 10s, See Techbrief TB334. . . . . . . . Tpkg |
260 |
℃ |
Required Field 
